DiClad880微波多层板制造技术研究
DiClad880微波多层板制造技术研究杨维生 奚洋 杨金卓南京电子技术研究所,江苏南京210013
摘 要:玻璃纤维编织增强聚四氟乙烯复合材料已为通讯所广泛采用，聚四氟乙烯微波多层印制电路板的制造技术越来越显现出其重要性，本文对一种DiClad 880微波多层印制板的制造工艺流程进行了简单的介绍，对选用CuClad 6700粘结片进行DiClad 880聚四氟乙烯多层微波印制板制造所采用的工艺技术进行了较为详细的论述。[著者文摘]
关键词:聚四氟乙烯 粘结片 多层板
分类号: TN41[著者标引]文献标识码：A文章编号：1009-0096（2007）10-0039-08栏目信息：特种印制板
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Study on Processing Technology of DiClad880 Microwave Multilayer Printed Circuit BoardsYang Weisheng, Xi Yang ,Yang JinzhuoYang Weisheng, Xi Yang ,Yang JinzhuoAbstract:The laminates of the woven fiberglass reinforced polytetrafluoetylene were widely used for communication. The fabrication technology of the microwave multilayer printed circuit board ofpolytetrafluoetylene was very important. The process of the DiClad 880 microwave multilayer printed circuit board was briefly introduced. The possibility and utility of the processing technology of the DiClad 880 polytetrafluoetylene microwave multilayer printed circuit board laminated by CuClad 6700 bonding film were also illuminated.[著者文摘]
Key words:polytetrafluoetylene; bonding film; multilayer printed circuit board
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