聚四氟乙烯结构氟碳聚合物薄膜的研究进展

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聚四氟乙烯结构氟碳聚合物薄膜的研究进展
Advances in the Study of Polytetrafluoroethylene- like  Fluorocarbon Film Deposition
作　　者：谷建东[1] 李东明[1] 冯志庆[2] 牛金海[2] 刘东平[2]

GU Jian - dong. LI Dong - ming, Feng Zhi - qing, NIU Jin - hai, LIU Dong - ping  （1. School of Mechanical Engineering, Dalian Jiaotong University, Dalian Liaoning, 116028, China;  2. Institute of Optoelectronic Technology, Dalian Nationalities University, Dalian Liaoning, 116605, China）

机构地区：[1]大连交通大学机械工程学院,辽宁大连116028 [2]大连民族学院光电子技术研究所,辽宁大连116605

出　　处：《大连民族学院学报》 CAS 2007年第9卷第5期 130-133页,141页,共5页

Journal of Dalian Nationalities University

摘　　要：聚四氟乙烯结构氟碳聚合物（Polytetrafluoroethylene-like fluorocarbon，PIFE-like FC）薄膜具有超低介电常数、高疏水性和生物相容性等优点．综述了国外制备PIFE-like FC薄膜的实验进展，分析了PTFE—like FC薄膜可能的沉积机理，指出热丝化学气相沉积（HFCVD）和射频等离子体辅助的化学气相沉积（rf—PECVD）这2种方法更有利于减少离子对薄膜表面的轰击作用，被认为是目前沉积PIFE-like FC薄膜最好的2种方法．介绍了利用介质阻挡放电（DBD）方法在低气压下制备FIFE-likeFC薄膜的最新进展．

Bulk polytetrafluoroethylene [ PTFE, （CF2）n] has many remarkable properties, includiilg a low dielectric constant, hydrophobility and biocompatibility. In this paper, the theory and the process of the experiment and the majority of proposed mechanisms are introduced. Plasma enhanced chemical vapor deposition and hot wire chemical vapor deposition are considered to be the two best methods for PTFE - like FC thin film deposition, because they are more beneficial to reduce ion bombardment. Also we introduce our recent research process of depositing PTFE - like FC thin films using dielectric barrier discharge （DBD） method under low pressure.

关 键 词：介电常数 氟碳聚合物薄膜 等离子体辅助化学气相沉积 热丝化学气相沉积
dielectric constant fluorocarbon film plasma enhanced chemical vapor deposition hot wire chemical vapor deposition
分 类 号： O484.1 [数理科学和化学 > 物理学 > 固体物理学 > 薄膜物理学]

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